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因应中国市场安全疑虑，传英伟达暂停H20芯片生产

简报：

据报道，英伟达已通知三星、艾马克（Amkor）等部分零部件供应商，要求暂停生产其专供中国市场的H20 AI芯片。
市场分析认为，此举与中国市场对H20芯片可能存在“远程追踪”或“远程控制”后门的安全疑虑高度相关。
英伟达未正面承认停产，回应称其在“持续不断地管理供应链以应对市场状况”，并曾多次澄清H20非军用产品。
中国外交部发言人毛宁对此回应称，建议向中方主管部门了解，并重申各方应共同维护全球产供链的稳定畅通。

相关链接：

Nvidia Reportedly Halts H20 Chip Production Amid China Market Security Concerns

Brief:

Nvidia has reportedly informed some component suppliers, including Samsung and Amkor, to suspend production of its H20 AI chips specifically designed for the Chinese market. 🚫
Market analysts suggest this move is highly related to security concerns within the Chinese market regarding potential "remote tracking" or "remote control" backdoors in the H20 chips. 🕵️‍♂️
Nvidia has not directly confirmed the production halt, stating only that it is "continuously managing its supply chain to adapt to market conditions." The company has also repeatedly clarified that the H20 is not a military-grade product.
Chinese Foreign Ministry spokesperson Mao Ning responded by suggesting inquiries be directed to relevant Chinese authorities and reiterated that all parties should collectively safeguard the stability and smooth operation of global industrial and supply chains. 🌍

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Suspend /səˈspend/

v. 暂停，悬挂

▶ "The match was suspended due to heavy rain."

[例句] 由于大雨，比赛被暂停了。

◼ 词根分析

sus-

在下，向上

-pend

挂

◼ 衍生词

suspension (n.) 暂停；悬挂

suspended (adj.) 暂停的；悬浮的

黄仁勋为Rubin新平台访台，确认台积电代工六款新芯片

简报：

辉达（NVIDIA）执行长黄仁勋于2025年8月22日抵达台湾，亲口证实此行主要为拜会台积电，感谢其对新一代AI平台Rubin的支持。
Rubin平台将有包含CPU、GPU在内的六款新晶片交由台积电代工，计划于今年10月完成流片，明年第二季进入量产。
黄仁勋在访问期间于台积电内部发表了以“分享经营哲学”为主题的演说。
此行亦包含私人行程，黄仁勋将为台积电创办人张忠谋补庆94岁生日。

相关链接：

Jensen Huang Visits Taiwan for New Rubin Platform, Confirms TSMC to Manufacture Six New Chips 🚀

Briefing:

NVIDIA CEO Jensen Huang arrived in Taiwan on August 22, 2025, personally confirming that the main purpose of his visit was to meet with TSMC to express gratitude for their support of the next-generation AI platform, Rubin.
The Rubin platform will feature six new chips, including CPUs and GPUs, to be manufactured by TSMC. Taping out is scheduled for October this year, with mass production commencing in the second quarter of next year.
During his visit, Huang delivered a speech within TSMC on the theme of "Sharing Business Philosophy." 🎤
The trip also includes a private itinerary, where Huang will belatedly celebrate TSMC founder Morris Chang's 94th birthday. 🎂

Pixel 10发布：搭载台积电3纳米芯片，AI功能全面升级

简报：

Google于纽约发布Pixel 10系列手机，其搭载的自研Tensor G5芯片首次采用台积电3纳米制程，为历代最大幅度升级。
AI功能成为核心亮点，包括新增“视觉叠加”以提供即时指引的Gemini Live、能保留用户声音特质的“通话即时翻译”，以及跨应用主动提供建议的“魔术提示”（Magic Cue）。
本次一同发布的还有Pixel 10 Pro Fold折叠屏手机，采用无齿轮转轴设计，并首次支持Qi2无线充电与IP68防水防尘。
Pixel 10 Pro系列机型将随附一年免费的Google AI Pro方案订阅服务。

相关链接：

Pixel 10 Unveiled: Featuring TSMC 3nm Chip, Comprehensive AI Upgrade

Brief:

Google unveiled its Pixel 10 series phones in New York. The self-developed Tensor G5 chip, featuring TSMC's 3nm process for the first time, marks the most significant upgrade in its history. 🚀
AI features are a core highlight, including the new 'Visual Overlay' for instant guidance via Gemini Live, 'Call Live Translate' which preserves the user's voice characteristics, and 'Magic Cue' for proactive cross-app suggestions. ✨
Also unveiled was the Pixel 10 Pro Fold foldable phone, featuring a gearless hinge design and introducing Qi2 wireless charging and IP68 dust and water resistance for the first time.
Pixel 10 Pro series models will include a one-year free subscription to the Google AI Pro plan. 🎁

谷歌发布Pixel 10 Pro Fold，内部信称其为史上最坚固折叠机

简报：

根据曝光的Google内部信件，新款折叠手机Pixel 10 Pro Fold号称是Google史上最坚固耐用的机型，能承受十年以上日常折叠使用。
该机搭载Google自研、采用台积电3奈米制程的Tensor G5晶片，并首次采用无齿轮转轴设计，也是Google首款具备IP68防水防尘的折叠手机。
规格方面，配备8吋内萤幕、6.4吋外萤幕，主镜头升级至4800万画素，并支持Qi2无线充电技术。
Pixel 10 Pro Fold在台湾市场售价为56,990元新台币起，将于10月9日于全通路上市。
信中提及辉达（Nvidia）执行长黄仁勋是Pixel手机用户，旨在帮助品牌打破“科技宅”形象，拓展更广泛市场。

相关链接：

Google Unveils Pixel 10 Pro Fold, Internal Memo Hails It as the Toughest Foldable Yet

Briefing:

According to leaked internal Google communications, the new Pixel 10 Pro Fold foldable phone is touted as Google's most robust and durable model ever, capable of withstanding over a decade of daily folding and unfolding. 💪
The device features Google's self-developed Tensor G5 chip, manufactured with TSMC's 3nm process. It also introduces a gear-less hinge design for the first time and is Google's first foldable phone to boast IP68 water and dust resistance. ✨
In terms of specifications, it comes with an 8-inch inner display, a 6.4-inch outer display, an upgraded 48-megapixel main camera, and supports Qi2 wireless charging technology.
The Pixel 10 Pro Fold will be available in the Taiwan market starting at NT$56,990, launching across all channels on October 9th.
The memo also mentions that Nvidia CEO Jensen Huang is a Pixel phone user, aiming to help the brand break its 'tech geek' image and expand into a broader market. 🚀

目录

因应中国市场安全疑虑，传英伟达暂停H20芯片生产

Nvidia Reportedly Halts H20 Chip Production Amid China Market Security Concerns

黄仁勋为Rubin新平台访台，确认台积电代工六款新芯片

Jensen Huang Visits Taiwan for New Rubin Platform, Confirms TSMC to Manufacture Six New Chips 🚀

Pixel 10发布：搭载台积电3纳米芯片，AI功能全面升级

Pixel 10 Unveiled: Featuring TSMC 3nm Chip, Comprehensive AI Upgrade

谷歌发布Pixel 10 Pro Fold，内部信称其为史上最坚固折叠机

Google Unveils Pixel 10 Pro Fold, Internal Memo Hails It as the Toughest Foldable Yet